The Next-Generation Wafer
Silicon wafers are a fundamental material in the production of semiconductor devices. Semiconductor devices are found in many different and very common products and components, including PCs, cell phones and other IT devices, digital cameras, TVs and other digital consumer electronics appliances, as well as automotive control systems. The evolution of semiconductor devices has enriched our lives by offering convenience and comfort.
SUMCO has been consistently committed to innovative research and development, quality enhancement and the stable supply of silicon wafers, contributing to rapid gains in the performance of semiconductor devices and meeting growing demand for the devices.
The history of progress in semiconductor devices involves repeated improvements in packing density, performance and economic rationality. An important contribution to this advancement has been made by the move towards larger silicon wafers. For example, a larger wafer diameter makes it possible to produce more semiconductor devices from a single wafer. This means a considerable rise in productivity and economic efficiency.
Dominant at present are 300 mm wafers, production of which began in 2001. For the next step, the feasibility of increasing the wafer size to 450 mm is being studied.
Fig.1 : The history of wafer size
Fig.2 : A larger wafer size considerably improves the production efficiency of semiconductor devices
Since 300 divided by 200 is 1.5, the area of a 300 mm wafer is larger than that of a 200 mm wafer by a factor that is 1.5 squared, or 2.25. It is therefore possible to produce from a 300 mm wafer 2.25 times as many IC chips of the same size as can be produced from a 200 mm wafer.
* Please note that the diagram is a schematic and does not reflect the method in actual IC chip production.
