The Next-Generation Wafer

As indicated by our analysis, 450mm wafers will be extremely susceptible to distortion, easily affected by vibration and more fragile than their 300mm counterparts. Therefore, such factors will need to be taken into account when designing manufacturing equipment and processes. Further, methods of transportation will also need to be considered for this larger diameter wafer.

Consequently, wafer thickness and other specifications will need to be determined based on industry-wide deliberation, taking into account various forms of technology and including considerations from device, equipment and wafer manufacturers.