Production Process
1. Wafer shaping (Slicing)
A single crystal ingot is cut and ground down into a uniform diameter, followed by slicing into wafers of about 1 mm in thickness by an inner saw or a wire saw.
2. Wafer shaping (Lapping)
In order to increase the parallelism and remove surface roughness made from saw cuts and process damages, the sliced wafers are mechanically lapped by use of alumina abrasive.
3. Wafer shaping (Etching)
The mechanical damages induced during the previous processes are removed by chemical etching.
4. Wafer shaping (Polishing)
The mechano-chemical polishing process improves the parallelism and makes highly flat surface by use of colloidal silica.
5. Wafer shaping (Cleaning and inspection)
The processed wafers are cleaned and inspected to be polished wafers.
